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Electroplated gold deposition / Connector gold plating

Leiterplatte während der Goldabscheidung mit BECE GALORSIT EPG-H für hochwertige Steckkontakte.

BECE GALORSIT EPG-H – Hard gold bath for glossy and durable layers.

BECE GALORSIT EPG-H is a mildly acidic hard gold bath specifically designed for depositing glossy gold layers with a purity of 99.8%. Combining exceptional wear resistance, ductility, and solderability, it is ideal for the electronics and PCB industries.

Outstanding Features

  • High Hardness and Ductility: Gold layers with a hardness of approximately HV 150 kp/mm² (depending on working conditions) offer exceptional wear resistance and flexibility.
  • Excellent Throwing Power: Uniform gold deposition even in complex geometries.
  • High Current Efficiency: Efficient gold deposition, making it suitable for cost-effective applications.
  • Excellent Solderability: Ideal for electrical connections requiring high-quality solder joints.
  • Pre-Gold Bath: BECE GALORSIT EPG-H PreDip effectively prevents the carryover of unwanted chemicals, maintaining the quality of the main bath.

Applications

  • PCB Manufacturing: Perfect for refining connector strips and electrical contacts, especially when paired with the BECE NiCORSIT EPG nickel electrolyte.
  • Rack and Barrel Plating: Versatile for use in various electroplating processes.

BECE GALORSIT EPG-H is the optimal solution for high-performance gold plating, delivering robust, glossy layers that meet the highest industry standards.

KEY PRODUCT ADVANTAGES:

  • Glossy, durable layers: Perfect surface for demanding applications
  • Flexible and efficient: Suitable for various electroplating processes and production scenarios
  • Reduced maintenance effort: The use of the pre-gold bath keeps the hard gold plating bath clean and efficient

Visualization Before and After:

Unbehandelte Leiterplatte vor der Anwendung von BECE GALORSIT EPG-H.
Leiterplatte nach der Anwendung von BECE GALORSIT EPG-H mit glänzender Goldoberfläche.