Electrolytic nickel plating process
In printed circuit board technology, the nickel electrolyte developed by us delivers, in conjunction with our hard-gold-electrolyt, optimal final surfaces for power strips and sliding contacts.
The bright nickel electrolyte separates ductile precipitates with very good depth dispersion and can be used in printed circuit board technology as well as in general galvinization for rack and barrel products.
The deposited nickel layer achieves a hardness of 560-570 HV0.1. The procedure is adjusted so that no edge weakness occurs at the holes of the printed circuit boards and at the edges of the plug contacts. Likewise, the nickel layer can be used as a support for bonded gold layers (aluminium wire and gold wire bonding).
Decisive product advantages
- Ductile layers
- Excellent throwing power