Electrolytic copper plating

After a conductive layer has been deposited on the bore-hole walls to electrically connect the individual layers of a printed circuit board, then copper can be deposited directly onto this conductive layer.

For this purpose, we offer sulphuric-acid, gloss copper electrolyts especially for printed circuit board technology, but they are also used in conventional galvanization technology for rack and drum products.

With our electrolyte, ductile, smooth and shiny copper deposits are deposited with excellent depth dispersion in high as well as low current densities. The electrolyte is adjusted so that no edge weakness occurs at the bore-holes of the printed circuit boards.


Decisive product advantages


  • Ductile, smooth and shiny copper layer
  • Very high throwing power


  • Simple bath control by only two additives
  • No weak edges at drill holes