Palladium activation ENIG
Before the production panels can be electroless nickel-plated and gold-plated, a metallic conductive layer of palladium must be applied to the copper.
For complete and uniform activation of the copper prior to chemical nickel plating, we can offer two different ionic activator systems as desired.
The chlorid- or sulphate-based activators are characterised by a simple bath management and contain no complexing agents and no surfactants. In combination with our chemical gold bath, these activators are ideally suited for the electrolss nickel/gold process in printed circuit board manufacturing.