Immersion gold (ENIG)

Especially for printed circuit board technology, we have developed a low-acid, electroless gold bath, with very good soldering and bonding properties, which serves as oxidation protection in the electroless nickel/gold (ENIG) process. 

The gold layers are particularly suitable for deposition on electroless nickel layers and are deposited in the exchange process to a layer thickness of 0.12 microns.